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반도체장비 semiconductor equipment

  • 300H_head plate(FC300, 1300X900X60)

  • 300H_main base(FC300. 1360X900X320)

  • 300H_y base(FC300, 680X390X50)

  • 300H_index base(FC300, 750X230X50)

  • 300H_card holder-nobinite(Ø570X34)

  • 300H_card holder-nobinite(Ø570X34)

  • winas_main base(FC300, 1500X950X450)

  • winas_gear box hosing(FC300, 680X345X204)

  • winas_manipulator frame(1500X450X360)

  • winas_head plate(1480X950X60)

  • winas_y base(FC300, 864X462X78)

  • winas_index base(FC300, 802X555X58)

  • winas_x base(FCD450, 450X310X50)

  • caste bonder_main frame(FC300, 1500X1400X460)

  • caste bonder_attachy upper base(1020X560X30)

  • caste bonder_y base(AC4CH-T5, 900X260X120)

  • caste bonder_wafer body(AC4CH-T5)

  • caste bonder_post(FC300, 230X130X325)

  • winas_cardholder-nand(FCD450, Ø620)

  • winas_base frame(광학계용)

  • 회사명.(주)구비테크
  • 대표이사.서정권
  • 주소.대구 달성군 현풍읍 테크노대로 4길 17
  • 전화.053-587-2335
  • 메일.gb2335@gubi.kr
  • 팩스.053-584-2335/616-2335

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