제품소개최소의 시간과 비용으로
최고의 품질과 서비스를 창출합니다.
반도체장비 semiconductor equipment
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300H_head plate(FC300, 1300X900X60)
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300H_main base(FC300. 1360X900X320)
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300H_y base(FC300, 680X390X50)
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300H_index base(FC300, 750X230X50)
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300H_card holder-nobinite(Ø570X34)
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300H_card holder-nobinite(Ø570X34)
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winas_main base(FC300, 1500X950X450)
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winas_gear box hosing(FC300, 680X345X204)
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winas_manipulator frame(1500X450X360)
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winas_head plate(1480X950X60)
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winas_y base(FC300, 864X462X78)
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winas_index base(FC300, 802X555X58)
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winas_x base(FCD450, 450X310X50)
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caste bonder_main frame(FC300, 1500X1400X460)
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caste bonder_attachy upper base(1020X560X30)
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caste bonder_y base(AC4CH-T5, 900X260X120)
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caste bonder_wafer body(AC4CH-T5)
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caste bonder_post(FC300, 230X130X325)
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winas_cardholder-nand(FCD450, Ø620)
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winas_base frame(광학계용)